About Syenta

As AI drives demand for high-bandwidth, high-density advanced packaging, the industry needs new manufacturing approaches that can scale beyond the limitations of conventional lithography-based metallisation. Syenta is building the tool, process, and engineering capability required to bring our LEM technology from demonstrated process technology into a robust, high-volume manufacturing platform.

We are now seeking a Head of Engineering to lead the engineering organisation responsible for delivering this platform. This is a senior technical leadership role at the intersection of first of a kind semiconductor tool development, high precision hardware, electrochemical deposition, and scaling to high volume manufacturing.

If you are an experienced engineering leader who has delivered complex manufacturing tools or high-precision hardware/software automation systems, and you can both develop a first of a kind tool, and transform it into a production ready manufacturing platform for next generation large area advanced packaging, this is the role for you.

The Role

We are seeking a Head of Engineering to lead and own the development of our Semiconductor manufacturing tool. You will be tasked to:

1. Own and drive engineering delivery of Syenta’s manufacturing tool.

• Translate company-level goals and CTO technical vision into engineering goals, project plans, milestones, resourcing, and delivery plans.
• Communicate delivery status, risks, blockers, trade-offs, and confidence clearly to theexecutive team.
• Collaborate across Engineering, Materials, Process, Software, Product, Commercial,Operations, external partners, and customers.
• Own key technical decisions for tool design, fabrication, subsystem development, integration, testing, and productisation.
• Oversee the design and integration of all critical tool subsystems across mechanical,electrical, software, controls, process, metrology, current delivery, fluid delivery, and automation.
• Manage critical suppliers, OEMs, and subcontractors required to deliver the tool.

2.Build and lead a high-performing Engineering team.

• Set expectations and standards for engineering process, decision-making, technicaldiscipline, communication, and accountability.
• Hire, mentor, and coordinate a growing engineering group, filling skills gaps andsetting clear objectives and KPIs.
• Champion rapid but rigorous development cycles, combining startup speed with disciplineddesign, testing, documentation, and data-driven decision-making.
• Create a culture of moving fast, technical clarity, quality, direct reporting, and early communication of problems.

About You

• You have independently led engineering teams responsible for the design, development, integration, or delivery of semicon manufacturing tools.
• You can translate ambitious technical goals into realistic project plans, milestones, resourcing plans, risk registers, and delivery schedules.
• You have experience delivering hardware systems on aggressive timelines.
• Broad semicon process and manufacturing technical fluency.
• You have designed, developed, integrated, or delivered complex hardware/software automation systems, involving precision motion, sensing, control, process equipment, metrology, data acquisition, or industrial automation.
• You are comfortable getting close to the technical work and understanding engineering reality, while also being senior enough to lead through people, systems, delegation, and process.
• You are motivated by building working systems that meet real customer and company needs, not only by interesting technology.
• You can balance immediate delivery requirements with longer-term platform development.
• You are excellent at communicating with executives, engineers, external partners, and customer-facing teams.

Desirable Experience

• A strong track record in designing, developing, and integrating semiconductor manufacturing tools (or equivalent). Both taking a tool or hardware product from concept to working prototype, and from prototype through to a productised system in volume production.
• Direct experience with high-throughput wafer-level processing, metallization, high precision alignment, or advanced packaging is highly desirable.
• Hands-on exposure to advanced semiconductor processes (electrochemical deposition, photolithography, wafer-level redistribution, TGV, interposer fabrication, etc.).
• Scaling engineering teams from early-stage/informal to structured and repeatable.
• Experience working in customer-driven product environments, not only research or technology-push environments.

Why Syenta?

We’re passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that canredefine an industry. Here’s what you can expect:

• Equity opportunities – We’re happy to discuss ownership stakes so that our success becomes your success.
• Work-life balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life.
• Professional growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business.
• Global reach – We welcome international candidates and encourage diverse perspectives to help drive our mission forward.

What We Offer

Salary Range: $200-250k (negotiable)

• Early-stage equity opportunities
• 12% superannuation contributions
• Flexible leave policies and a strong work-life balance
• Professional growth in a high-impact, fast-growing deep-tech startup
• Team events and collaborative culture, including company-wide gatherings in Australia

If you’re excited to tackle this one-of-a-kind challenge, let’s talk! This role is based full-time in our Sydney office. We welcome applications from candidates currently located both within Australia and internationally. Relocation assistance and visa sponsorship are available.

Apply here or send your CV and a short note to careers@syenta.com.